Chapter 1: Development and Fabrication of IC Chips

Chapter 2: Plastics, Elastomers, and Composites

Chapter 3: Ceramics and Glasses

Chapter 4: Metals

Chapter 5: Solder Technologies for Electronic Packaging and Assembly

Chapter 6: Electroplating and Deposited Metallic Coatings

Chapter 7: Printed Circuit Board Fabrication

Chapter 8: Materials and Processes for Hybrid Microelectronics and Multichip Modules

Chapter 9: Adhestives Underfills, and Coatings in Electronics Assemblies

Chapter 10: Thermal Management Materials and Systems

Index