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Tables of Contents for Semiconductor Packaging
Chapter/Section Title
Page #
Page Count
Semiconductor Packaging (K. Brown).
Interconnect Substrate Technologies (I. Turlik).
Electronic Module Technology (P. Sandborn & D. Herrell).
Interassembly and Intersystem Interconnect (R. Mroczkowski).
Manufacturing Multichip Modules (R. Agarwal & M. Pecht).
Electronic System Topology and Design (D. Schmidt).
Electrical Design of Packaging Systems (R. Mittra & C. Gordon).
Thermal Design and Control (A. Bar-Cohen).
Vibration and Shock Analysis (F. Barez).
Mechanical Design Methodologies in Electronic Packaging (E. Suhir).
Electronic Packaging Materials and Their Properties (M. Pecht & R. Agarwal).
Reliability Issues (M. Pecht).
Indexes.