Product Description: Understand, design, and manufacture plastics This resource provides you with the state-of-the-art information for the design, manufacture and application of plastics as well as its cutting-edge usage in nanotechnology. Includes the latest industry specifications and standards Covers the latest recycling method...read more

Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook,Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more. (view table of contents)

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Product Description: The first handbook devoted to the coverage of materials in the field of fire engineering. Fire Protection Building Materials Handbook walks you through the challenging maze of choosing form the hundreds of commercially available materials used in buildings today and tells you which burn and /or are weakened during exposure to fire...read more (view table of contents, read Amazon.com's description)

A revised, updated and expanded reference (the first edition of 1970 was titled Handbook of Materials and Processes for Electronics ) on electronic materials and process technology, presenting a source book of practical material data, guidelines, information and manufacturing methods including cost and fabrication trade-off, design and application criteria, and performance limits. Annotation copyright Book News, Inc. Portland, Or. (view table of contents)

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Product Description: * Step-by-step coverage of the entire assembly fabrication process: boards, soldering, packages, substrates, and deposition * Non-specialists guide to assembly fabrication--no advance degrees or math background necessary (view table of contents, read Amazon.com's description)

Product Description: Stay ahead of the learning curve in the fast-evolving field of materials technology Need to come up with new product concepts? Do you select the materials and designs that make innovative ideas work,? Edited by Charles Harper, an internationally respected expert in materials technology, Handbook of Materials for Product Design is an indispensable asset to anyone involved in product creation...read more (view table of contents, read Amazon.com's description)

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Product Description: A guided tour through the new generation of high-performance printed circuit boards (PCBs) and ceramic substrates Packed with leading-edge information, including data, details and guidelines on microvias, built-up multi-layers, high-density boards, and advanced ceramic substrates Covers environmentally safe PCB materials and processes Essential for electronics engineers, designers, and technicians--plus manufacturing and mechanical engineers...read more (view table of contents, read Amazon.com's description)

Product Description: This second edition will provide data, information and guidelines for all of those who design, manufacture and use passive component systems and technologies in all categories of electronic systems. It will also be used by those who develop and market these components and component technologies...read more

Product Description: Complete with coverage of the latest microwave and electro-optic components, the new edition of this classic reference meets the needs of all engineers who design, manufacture, and use active components in all categories of electronic systems...read more (view table of contents, read Amazon.com's description)

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